|
||
|
|
|
|
FREQUENTLY ASKED QUESTIONS
Q. What is the largest part you can handle?
A. The maximum footprint is 12 x 24" (609 x 304 mm). We typically fabricate parts that are no larger than a microtiter plate, but have made instrument manifolds that are approx. 12 x 12 inches.
Q. What macrofluidic connections do you support (i.e. Upchurch fittings, proprietary)?
A. We use bondable hose barb connections (Value Plastics) and we can have standard threaded fittings machined in for flared bottom tube connections. We can also insert press fit tubing connections that are also epoxied to seal and hold them securely.
Q. Can you machine holes coming from the channels going to the outside (just plain holes)?
A. Not a problem, in fact easiest for us.
Q. What is the smallest hole size you could handle, what does the cross section area look like?
A. The smallest hole depends on the thickness of the material. For a 1/16" thick layer (1.5 mm) the smallest hole is about 150 microns, the angle on that hole is about 6 degrees.
Q. What materials do you work with (PMMA, COC, etc.)?
A. This you can find in more detail at our website http://www.alineinc.com/technology.html, but, with our CO2 laser, typically we can cut any thin plastic film up to 250 microns. Beyond that, PMMA, and Delrin cut well.
Q. What is the smallest feature size of the following?:
A:
Q. What is the surface roughness of you channels?
A. 1-5 microns
Q. Can you coat surfaces to be hydrophilic?
A. Utilizing atmospheric Ar plasma we can make the surface wet out and promote capillary flow.
Q. What is your preferred process for design submission?
A. We work with .dxf files that are compatible with AutoCAD 2000, but we typically help you design the part to work with our fabrication process.
Q. What is the solvent compatibility?
A. For pressure sensitive bonded devices, 70% alcohol (IPA, EtOH). For thermal bonded devices 95% EtOH or IPA.
Q. What is your manufacturing technique?
A. Laser or die cut layers in a variety of polymeric materials that are aligned, stacked, and bonded with pressure sensitive adhesives or thermal bond adhesive.
Q. Approximately what is a typical cost and lead time?
A. For a simple three layer device, the cost is about $1850 including set-up, materials, and shipping. Turnaround time is 3-7 days.
For further information, please contact a Technical Consultant directly at