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Adhesives and Sealants for Electrical Assembly-Image

Benefits of Using Adhesives and Sealants for Electrical Assembly/Electronics

Reducing Your Costs...Expanding Your Options

Join Dissimilar Substrates

An electrical equipment manufacturer selected a two-component heat cure epoxy to join metal and ceramic substrates in a heat sink bonding application (dispensed in a lap configuration)…

- Adhesives can cost-effectively join two different types of substrates, resulting in greater flexibility of design and innovative product assembly.

Streamline your Process and Save Money

An electronic component manufacturer replaced a mechanical fastener with a one-component UV-VIS cure methacrylate adhesive in an electronic array packaging application. A relatively small amount of adhesive (0.5 - 4 grams per SKU) was applied in a filet configuration via precision syringe with a life expectancy of at least 5 years…

  • Adhesives enable a reduction in the number of overall components in the final part without compromising the bond or thermal efficiency.
  • Applied cost of adhesives can account for less than 1% of the total manufactured cost of the product.
  • Adhesives meet the following specifications: ATM-0018, ATM-0089, ATM -0087, ATM-0068 and ATM-0031.
  • Robotics can be used to apply adhesives, streamlining the process even further.

Improve Thermal Efficiency

An electrical equipment manufacturer selected a two-component heat cure epoxy to join metal and ceramic substrates in a heat sink bonding application (dispensed in a lap configuration)…

  • Adhesives provide excellent thermal efficiency properties to the final product.
  • Adhesives offer multi-functional benefits, often resulting in new business opportunities.

Reduce Component Weight

An electrical equipment manufacturer chose a two-component heat cure epoxy to join metal and ceramic substrates in a different type of heat sink bonding application (dispensed in a lap configuration)…

- Adhesives not only reduce the weight of the overall part, but also dramatically improve the component's thermal efficiency.

Click here to view PDF Benefit Statement

 
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