Peel-A-Way® Board to Board Connectors

Product Announcement from Advanced Interconnections Corp.

Single, Dual and Triple Row Board to Board Connectors featuring screw-machined terminals available in either RoHS Compliant high temp. molded LCP insulators, FR-4 or Peel-A-Way® removable terminal carriers. More information...

  • Sockets (female) and adapters (male headers) are designed in mating pairs
  • .050" (1.27mm) and .100" (2.54mm) centers spacing row to row
  • High reliability screw-machined terminals
  • Wide variety of configurations available
  • Standard and custom designs
  • Carrier can be removed after soldering or left in place for added stability
  • Available with Gold/Gold or Matte Tin/Gold plating for lead-free compatible processing

Quick Links for our Peel-A-Way® Carrier Products:

About Advanced Interconnections:

Advanced Interconnections Corp. is an ISO 9001 Certified designer and manufacturer of innovative interconnect solutions with technologically advanced features. Their patented designs offer high reliability in development, test, validation, and production level device-to-board and board-to-board applications.

Advanced Interconnections specializes in IC Sockets and Adapters for BGA, PGA, CSP, QFP, PLCC, SOIC, DIP, and SIP packages as well as IC Package Conversion Adapters and Board-to-Board Connectors. Standard and custom designs are available, all featuring screw-machined terminals for superior quality and field-proven performance. To comply with the RoHS Directive and the worldwide movement toward environmentally-friendly manufacturing, Advanced is pleased to offer all of their products with lead-free options.

Links to our full product line: