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Advanced Power Electronics Corp. introduces four new MOSFET products in GreenFET™ packages using the DirectFET® packaging technology licensed from International Rectifier. Designed for use in AC-DC and DC-DC power conversion applications in computers, notebooks, telecommunications and consumer electronics devices, these surface-mount power packages offer extremely efficient cooling for Power MOSFET chips in an SO-8 footprint or smaller. Unlike standard plastic discrete packages, the GreenFET metal can construction enables dual-sided cooling to significantly increase the current handling capacity in high frequency power conversion applications.

Since obtaining the license from IR, Advanced Power Electronics Corporation has been packaging and testing its latest generation of MOSFET chip technology in both small and medium size GreenFET power packages to ensure compatibility and long-term reliability. Samples of the first products in both size GreenFET packages with footprints identical to the corresponding SQ, ST, MP and MX DirectFET packages are now available.

DirectFET and IR are registered trademarks of International Rectifier Corporation.

GreenFET is a trademark of Advanced Power Electronics Corp.