Advanced Multilayer Packaging for Optoelectronics Applications

• Multilayer AlN FPA substrates up to 110 mm x 110 mm[4.3” x 4.3”] in size with thin film metallization
• Flatness of less than 5 microns
• Nonmagnetic packaging options
• Multiple interfaces for connectors
• Hermiticity rates greater than 1 x 10^-8 cc He/s
• High temperature to cryogenic applications
• High power feedthroughs
• Military, Aerospace & Medical Applications

About AdTech Ceramics:

• 30+ years of ceramics Manufacturing
• 15+ years of Aluminum Nitride (AlN) Multilayer Technology
• Ceramic Injection molding
• Microwave Modeling & Design