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Aremco-Bond^tm 556-LV is an advanced, two-part, low viscosity conductive adhesive formulated using high purity silver flake. This system exhibits a volume resistivity of less than 0.0008 ohm-cm at room temperature, and a thermal conductivity of 2.2 W/m-^oK. The continuous operating temperature range is 340 ^oF (141 ^oC) and intermittent use temperature is 375 ^oF (190 ^oC). The tensile shear strength is 1,100 psi and Shore D hardness is 84. Viscosity range is 4,000 to 6,000 cP.

Aremco-Bond^tm 556-LV mixes easily in a 100-to-4 ratio by weight. It sets at room temperature in 24 hours or can be heat cured in 2 hours at 200 ^oF. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request.

Typical applications for Aremco-Bond^tm 556-LV include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.

Please contact Aremco's Technical Sales Department for more information about this advanced new product.