Product Announcement from Aremco Products, Inc.

AREMCO-BOND™ 2318 HIGH TEMP POTTING COMPOUND -Image

Aremco-Bondtm 2318 is a medium viscosity, black-pigmented, high temperature epoxy compound used in electrical and electronic applications from -55 to +185 ° C (-67 to 365 oF). Aremco-Bondtm 2318 provides high flexural strength of 12,300 psi, tensile-shear strength of 1,135 psi, volume resistivity of 3.0 x 1015, dielectric strength of 460 volts/mil, and dielectric constant of 4.8 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.

Aremco-Bondtm 2318 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 12 parts hardener by weight. Mixed viscosity is 16,000 cP and the pot life for a 100 gram mass is 2 hours at room temperature. Recommended cure is 4 hours at room temperature plus 2 hours at 200 oF. An alternative cure schedule is 24 hours at room temperature. Cured product exhibits a linear shrinkag of .003 in/in and a Shore-D hardness of 89.

Aremco-Bondtm 2318 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, semiconductors, and electrical feed-thru bushings.

Aremco-Bondtm 2318 is supplied in easy to mix pint, quart and gallon kits. Please contact Aremco's Technical Sales Department for more information about this advanced product.

 
You have successfully added  from  to your part list.
 
Part Name / #:
Product Type:
Description: