Fastening, Joining & Assembly Newsletter Signup
Get the Engineering360
Stay up to date on:
Fasteners and materials, and the tools and systems that automate application/dispensing and assembly/disassembly.

AREMCO-BOND™ 2318 HIGH TEMP POTTING COMPOUND

Product Announcement from Aremco Products, Inc.

AREMCO-BOND™ 2318 HIGH TEMP POTTING COMPOUND -Image

Aremco-Bondtm 2318 is a medium viscosity, black-pigmented, high temperature epoxy compound used in electrical and electronic applications from -55 to +185 ° C (-67 to 365 oF). Aremco-Bondtm 2318 provides high flexural strength of 12,300 psi, tensile-shear strength of 1,135 psi, volume resistivity of 3.0 x 1015, dielectric strength of 460 volts/mil, and dielectric constant of 4.8 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.

Aremco-Bondtm 2318 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 12 parts hardener by weight. Mixed viscosity is 16,000 cP and the pot life for a 100 gram mass is 2 hours at room temperature. Recommended cure is 4 hours at room temperature plus 2 hours at 200 oF. An alternative cure schedule is 24 hours at room temperature. Cured product exhibits a linear shrinkag of .003 in/in and a Shore-D hardness of 89.

Aremco-Bondtm 2318 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, semiconductors, and electrical feed-thru bushings.

Aremco-Bondtm 2318 is supplied in easy to mix pint, quart and gallon kits. Please contact Aremco's Technical Sales Department for more information about this advanced product.