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Bunting Magnetics Co. - New Magnetic Die-Cutting Cylinders from Bunting

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Bunting Magnetics Co. has added new X-treme™ Series Magnetic Die-Cutting Cylinders to its line of magnetic printing cylinders, standard die-cutting cylinders, bases, and related printing products. X-treme Series Die-Cutting Cylinders are machined from solid metal to resist deflection and ground to extremely close tolerances that are reported to be the tightest in the printing industry. X-treme Cylinders allow on-press die mounting and enable printers to replace costly hard-tooled cylinders with economical flexible steel dies. They can also turn out embossing when used with Bunting's flexible 2D and 3D embossing dies. X-treme Cylinders handle high press speeds, eliminate conventional makeready materials, and reduce expenditures on hard tooling and labor. Like all Bunting Cylinders, they are built to OEM specifications and guaranteed to fit the press for which they are ordered.

Setups on X-treme Series Magnetic Cylinders are fast, and registration is precise with standard cylinder scribe lines or optional pins. Flexible steel dies mount quickly, store easily, and can be produced with lead times as short as two days. Powerful magnets built into the surface of the X-treme Cylinders hold dies in place so that they do not lift or shift.

Bunting X-treme Series Magnetic Die-Cutting Cylinders accept a variety of readily available flexible steel dies. But these cylinders are built to close tolerances specifically to take advantage of today's close-tolerance dies. X-treme Cylinders are designed for precision die-cutting applications and achieve clean cuts even on synthetics, on "no-look" labels, and on 1-mil stock with 1-mil liner.

Bunting Super Grind finishing creates a true die-cutting surface that produces clean cuts and crisp embosses with less pressure and results in less substrate waste, longer die life, faster production speeds, and smoother, quieter press operation. With the added precision, Bunting claims that printers can successfully handle a wider range of substrates, including thin films, plastics, coupons, and multi-layer projects.

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