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We have the skill, expertise and equipment to meet your needs!

Machine and hand placement capabilities, which include:

• Placing packages as small as 0402.
• BGA, SOIC, PLCC, QFP are all standard packages for us.
• We can also handle ultra fine pitch to 0.015".
• X-ray and AOI equipment.
• Prototype through pre-production and small volume to high volume capacity.

Our expertise with SMT assembly combined with through-hole, mixed technology, wire harnessing and electro-mechanical assembly make Caladena the optimum choice for all your assembly requirements.