Surface Technology Systems Silicon Etcher,

Product Announcement from Capovani Brothers Inc.

Surface Technology Systems Silicon Etcher,-Image

Surface Technology Systems Silicon Etcher MXP ICP ASE HR

Silicon Etch Bosch Process - Year 2003

Wafer Size Range:
Minimum: 50 mm
Maximum 200 mm
Set Size 150 mm

Process: Silicon Etch Bosch Process

Loadlock: YES
Loadlock Pump: Edwards E2M40

High Vacuum Pump: Pfeiffer MAG 2000
Roughing Pump: Edwards IQMB250 & IQDP80
RF Generator: ENI Power Systems ACG-3B and Advanced Energy RFG 3001

Number of Gas Inputs: Four Gas

Process Gases: SF6, C4F8, O2, Ar

Chiller: Huber Unistat 140W

ICP V2 - Balun coil
Carousel in MkIV MPX - 2 x 150mm wafers
3KW Source
300/30W platen
E-Rack Modules: HCL1 +HCU3 +HCU5+VAC3Y +2x AMC1 +HBC2

Other Information:
Windows 2000
Bosch license

Manufactured in 2003

Current Power Requirements: 400V , 50Hz, 40 Amp, 3 phase
Unit can be configured for: 208/460, 60 Hz, 3 Phase.
Please request at time of purchase.

CE Marked

Capovani Brothers Item no. 102178