China Zhong Sen International Co.,Ltd
1 Material FR-4, High TG FR-4, ，Halgon free FR4,Rogers4003, Rogers4350, Aluminum Base, etc.
2 Layer Counts 1-20 L
3 Inner Layer Base Copper Thickness HOZ, 1OZ, 2OZ, 3OZ, 4OZ
4 Out Layer Finished Copper Thickness 1OZ, 2OZ, 3OZ, 4OZ,5oz,6oz etc.
5 Max Finished Size 24*35inch
6 Min Line Width/Space 4/4mil
7 Board Outline Tolerance (Mechanical) ±0.15mm
8 Board Thickness 0.20mm-6.00mm
9 Thickness Tolerance t＜1.0mm±0.1mm，　t≥1.0mm ±10%
11 Min Drilling Diameter 0.2mm
12 Min Drilling Slot Diameter 0.60mm
13 Min Via Pad Diameter 20mil
14 Min BGA Pad Diameter 12mil
15 Max Aspect Ratio 12:1
16 Min Solder Thickness 9um
17 Solder Mask color Green，blue，red，yellow，black etc.
18 Min Solder Bridge 5mil
19 Solder Mask Hardness ≥6H
20 Min Silkscreen Trace width 5mil
21 Min Silkscreen Height 30mil
22 Silkscreen Color white，yellow， black
23 Min Space Between Drill To Trace 10mil(2-6L)，12mil(≥8L)
24 Space Between Gold Finger 10mil
25 Impedance Control Tolerance ＜50Ω, ±5Ω；
≥50Ω, ±10%
26 Surface Finish HAL，Flash gold，Immersion gold，OSP，Immersion Tin, Immersion silver etc.
27 Flammability Rate 94V-0
28 Inspection Standard IPC-A-600F