Product Announcement from Comchip Technology Corporation
• RoHS, Halogen-Free, and REACH compliant
• No Tin = No Tin Whiskers = Long-term reliability
• Copper/Nickel/Gold termination: reliable soldering in standard and RoHS reflow processes
• High temperature molding material: 3x at 260 degrees Celsius
• No lead-frame: improved structure improves reliability and lowers costs
• Flat-chip stays put: no rolling, shifting, or tomb-stoning
• Minimizing reworks lowers production costs
• Excellent for high-speed surface mount, increases efficiency
• Large bonding area: less mounting precision required
• Direct drop-in replacement for lead-framed packages
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