Product Announcement from Comchip Technology Corporation

New 40% Thinner SOD-123 Chip Package: SOD-123H -Image

Comchip has developed a new version of the popular SOD-123 chip package.

The SOD-123H (H = Height reduction), 40% thinner than the standard SOD-123, measures just 0.8mm (Typ.) in height. Meeting the demand for increasingly thinner electronics, the SOD-123H utilizes the same footprints as the SOD-123, eliminating the need to redesign the existing pad layout.

During testing, the SOD-123H is much easier to hand-solder due to the large bonding pad. Conventional bonding pads on the SOD-123 measure 0.25 - 0.40mm in length. The bonding pad of the SOD-123H measures 0.80mm in length, nearly double the pad size.

Currently available in Schottky diodes and rectifiers. The SOD-123H is available with an average rectified current of either 1A or 2A and reverse voltages ranging from 20-1000V.

View the SOD-123H product line at Digi-Key

View the SOD-123H product line at Mouser: Rectifiers Schottky Diodes

 
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