New 40% Thinner SOD-123 Chip Package: SOD-123H
Product Announcement from Comchip Technology Corporation
Comchip has developed a new version of the popular SOD-123 chip package.
The SOD-123H (H = Height reduction), 40% thinner than the standard SOD-123, measures just 0.8mm (Typ.) in height. Meeting the demand for increasingly thinner electronics, the SOD-123H utilizes the same footprints as the SOD-123, eliminating the need to redesign the existing pad layout.
During testing, the SOD-123H is much easier to hand-solder due to the large bonding pad. Conventional bonding pads on the SOD-123 measure 0.25 - 0.40mm in length. The bonding pad of the SOD-123H measures 0.80mm in length, nearly double the pad size.
Currently available in Schottky diodes and rectifiers. The SOD-123H is available with an average rectified current of either 1A or 2A and reverse voltages ranging from 20-1000V.