Cymbet Teams with Micross for EnerChip Bare Die
Product Announcement from Cymbet Corporation
Cymbet Corporation announced today that they are teaming with Micross Components to distribute and package Cymbet's entire family of EnerChip™ Smart Solid State Batteries and ultra low power management IC solutions in bare die form. Cymbet's EnerChips are constructed on silicon wafers using semiconductor processing techniques which make them perfect for co-packaging with other Integrated Circuits carried on the Micross line card. Energy storage can now be embedded directly into a single miniature multi-chip package. Embedded energy opens up new innovative product capabilities that previously could not be realized with legacy energy storage devices.
"Micross Components is an ideal partner for Cymbet as they specialize in bare die distribution and hi-reliability microelectronics component assembly and integration," said Bill Priesmeyer Cymbet CEO. "The aim of Micross is to provide a single solution to a customer's requirements and now they can offer integrated EnerChip batteries that will solve previously unmet needs."