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DALSA is one of the world's foremost pure-play MEMS foundries. What sets us apart is our mastery of a vast and unique wafer fabrication repertoire. Years of devoted R&D have earned us a profound understanding of the physics and materials science that make MEMS possible. Our MEMS process module portfolio is recognized as exceptional and represents true competitive advantage for our customers. Proof of our abilities is our enviable track record of moving customer designs to volume production quickly and smoothly.

DALSA puts all its experience at your command to bring your breakthrough designs from conception to reality. Our rare ability to optimize architecture, performance, and reliability serves high-volume, mission-critical microsystems in a wide range of industries.

Further differentiating DALSA are our design capabilities not only with MEMS themselves, but with the high voltage drivers often needed for MEMS devices' optimal performance. DALSA's unmatched custom MEMS and HV ASIC design service can supply components or complete solutions to bring your MEMS applications to their maximum potential.

With our rigorous ISO/TS 16949 registered quality system and our dedication to customer service, we offer a commitment to success that is matched only by your own.

Our fabrication strengths include integration of sense and actuation circuitry alongside MEMS structures, flexible wafer-scale packaging, and a range of materials, equipment, and process flows that enable the most advanced MEMS and image sensor performance. Many of our process technologies are usually considered unconventional or even contradictory in mainstream integrated circuit production, but DALSA Semiconductor's foundry services together provide designers and customers with a rare ability to optimize architecture, performance, and reliability to meet the needs of high-volume, mission-critical microsystems in photonics, telecom, biomedical, automotive, and industrial applications.

Beyond fabrication, DALSA Semiconductor offers the tighter coupling of front-end fabrication with back-end packaging processes required for high-performance MEMS. Since by their nature MEMS devices require interaction with their environments beyond electrical signals, the testing, assembly and packaging appropriate for more mainstream ICs are often insufficient to ensure reliable performance. DALSA Semiconductor has the equipment and process expertise to protect and preserve device performance through the crucial finishing operations.

DALSA Semiconductor's rare combination of capabilities, including innovative sense and actuation circuit integration, comprehension packaging, volume production, and reliability allow us to help you succeed with advanced, highly-differentiated, and cost-effective designs.

Note:

• DALSA Semiconductor GM, Claude Jean, will speak at SEMICON West conference and trade show July 14 in San Francisco, CA.
• DALSA Semiconductor is exhibiting at Transducers, June 21-25, 2009, Denver, Colorado.

For additional information contact sales.semi@dalsa.com