CB design, layout, fabrication, assembly and function test
IC precision: 0.4mm pinch distance
Lead-free technology SMT process
Up to 22 layer mixed assembly technology used on industry controls
Boards for network, communication and industry control
Type of productions:
SMT and though-hole
BGA and COB
Plastic injection
Die casting
Sheet metal stamping
X-ray and ICT test
With IPC 610 manufacturing standards and other international standards
Within two hours to reply the inquiry via E-mail, 2 to 3 working days to provide the quotations
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