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DRC's technique utilize photolithographic processes in combination with thick and thin film techniques to processes to creat custom, high-density passive circuits or compact assemblies.

When small components are needed.

Design & product engineers that have a limited space requirments and dictates small size. as well as high-technology manufacturers who need to fabricate new, proprietary, and unusual microcircuits or special multi-layer assemblies for unique applictions.

If your application includes any of the following characteristics, our technolgy could be your ssolution:

• severe size and space constraints
• chip on-board micro-miniaturization
• lines or spaces down to (5 microns)
• multiple layers flex polyimide circuit
• small vias
• special substrates (Kapton, ceramics, glasses)

Metrigraphics Technology includes:

• Thin film (additive) circuitry - Combinations of sputtered, electroformed, lift-off evaporation, dry or wet etching, lamination, and silk screening.
• Fine lines - DRC specializes in line widths from .001" (25.4 microns) and down. Line widths and spaces of .0004" (10 microns) are demonstrated on the free sales sample. Circuitry on or over substrate edges is not unusual.
• Multi-layer construction - Thin glass, Kapton, and liquid polyamides are common dielectrics. Many other screened, thin-film, or sputtered dielectrics are also available.
• Special substrates - We have worked with glass, quartz, fused silica, alumina, sapphire, stainless steel, Kapton, FR-4, G-10, copperclad invar, special optical materials, as well as machined/polished alloys. A wide variety of sizes and shapes can be accommodated.