Metriform II is DRC's technique for the selective application of several photolithographic processes in combination with thick and thin film techniques to create custom, high-density passive circuits or compact assemblies.

Who needs Metriform II components?

Design and application engineers and high-technology manufacturers who need to fabricate new, proprietary, and unusual microcircuits or special multi-layer assemblies.

If your application includes any of the following characteristics, Metriform II is your solution:

• severe size and space constraints
• chip on-board micro-miniaturization
• fine lines or conductors (5 microns)
• multiple layers
• small vias
• special substrates (Kapton, ceramics, glasses)

Metriform II Technology includes:

• Thin film (additive) circuitry - Combinations of sputtered, electroformed, lift-off evaporation, dry or wet etching, lamination, and silk screening.
• Fine lines - DRC specializes in line widths from .001" (25.4 microns) and down. Line widths and spaces of .0004" (10 microns) are demonstrated on the free sample. Circuitry on or over substrate edges is not unusual.
• Multi-layer construction - Thin glass, Kapton, and liquid polyamides are common dielectrics. Many other screened, thin-film, or sputtered dielectrics are also available.
• Special substrates - We have worked with glass, quartz, fused silica, alumina, sapphire, stainless steel, Kapton, FR-4, G-10, copperclad invar, special optical materials, as well as machined/polished alloys. A wide variety of sizes and shapes can be accommodated.