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Design Guide For High Density Flexible Circuits

Suitability of Metrigraphics High Density Flexible Circuitry. These micro flex circuits are used in applications requiring high flexibability in microcircuitry not possible with tradiitonal etch processing technique.

Single Layer Circuits

Applications:

• Invasive Medical Devices
• High Density Interconnects
• In-Vitro Diagnostics
• Environmental Sensors
• High Energy Measurement Small Lot Array (Sheet) 114.3 mm x 114.3 mm (4.5" x 4.5")Production Lot Array (Sheet) 254.0 x 254.0mm (10.0" x 10.0")

Minimum Trace/Space 0.003 mm (0.00010")

Conductor Width/Thickness Dependent on the minimum line/space ratio of the entire circuit.

Minimum Width: 0.003 mm (0.00010"),0.005 mm (0.00019"), 0.010 mm (0.00039")

Minimum Thickness: 0.0005 mm (0.000019"), 0.0010 mm (0.000039"), 0.0020 mm (0.000078")

Maximum Thickness: 0.001 mm (.000039"), 0.002 mm (0.00008"), 0.005 mm (0.00019")

Sheet Resistance of Plated Gold (Au) Conductors: 0.09 Ohms/Square at 0.0005 mm (0.000019") thickness, 0.03 Ohms/Square at 0.0033 mm (0.00013") thickness

Substrate Materials (Typical) Thickness Dielectric Constant

Coefficient of Thermal Expansion (CTE)

Dupont

Kapton®: Polyimide Film, 0.0076 mm - 0.125 mm, (0.000299" - 0.0049"),3.9-4.0, 20 ppm/oC

Ube Industries

Upilex®S

Polyimide Film, 0.0075 mm - 0.125 mm (0.000295" - 0.0049")

3.2-3.5 ,1.2-2.0x10-5cm/cm/oC HD Microsystems

PI 2611®, Cast Polyimide

0.005 mm - 0.025 mm (0.00019" - 0.00098")

2.9., 3 ppm/oC

Two-Layer Circuits

All of the information above applies to 2-layer circuits, plus the information below:

Vias

Recommended: 0.050 mm (0.0019"). Minimum via size: 0.025 mm (0.00098")

Dielectric Interlayers

Arch Probimide®7000 - Dielectric Constant 3.3, CTE 27 ppm/oC

HD Microsystems PI 2730® - Dielectric Constant 2.9, CTE 16 ppm/oC

Contacting Metrigraphics

metsales@drc.com

Data Format

AutoCad or DXF files are preferred. Drawings should be in zero width chained polylines.

Other formats may incur cost.

Data Exchange

Data can be sent via E-Mail to: metsales@drc.com in zipped format or sent to the DRC FTP site.