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The micro-structures can be free-standing or permanently bonded to silicon wafers or any relatively smooth substrate. To date, we have built micro-structures with features as small as 0.002mm and aspect ratios as high as 20:1. (See chart below for aspect ratio guidelines.) This capability relies on a variety of commercially available photoresists and Metrigraphics' considerable experience in photo lithography, thin-film deposition, electroplating.

Metrigraphics has developed a processes for forming micron structures pf various heights on Ni Co that replicate smooth channels for microfluidic chips. This process allows for building mold micro structure on Ni Co for molding PDMS, injection molding tools or Ni Co embossing stamps for soft lithography. The properties of Ni Co and the process of electroforming make an ideal process for fabricating smooth channels in a very hard metal. The eletroforming process, provides very precise tolerances with a small positive draft angle