300-micron glue dots are applied to a wafer at a rate of 3 per second with 25 micron accuracy.

Sophisticated process tool that uses high performance machine vision and precision motion control to apply small glue dots (300 micron diameter) to the surface of a wafer. Wafers are loaded via cassette or single station, then placed on the X-Y stage using a Brooks/PRI wafer handling robot. Vision system inspects dot placement and size during process.

High speed, high precision glue dispensing with vision inspection. Inspection data written to a log associated with the wafer.

Specifications

• CONTROL SYSTEM: Windows NT™ with RTX real time extension; custom control program in C++™. Similar machines have been upgraded to Windows 2000.
• HANDLING ROBOT: Equipe/PRI Automation.
• OPERATOR INTERFACE: Custom multi-screen operator interface written in C++™.
• THROUGHPUT: Three dots/second.
• VISION SYSTEM: Cognex® with Melles Griot optics.
• ACCURACY: ± 25-micron placement accuracy.
• WAFER TRACKING: Cognex® OCR system to read wafer serial number.
• SERVO CONTROL: Galil® four-axis motion control.
• ENVIRONMENT: Class 10,000 clean room.
• DISCREET I/O: Approximately 144 I/O points.