Attach small, thin components to wafer with better than 1 micron accuracy, 99.9% quality, and self-inspection in 1.25 seconds.

This machine attaches small, thin components to the surface of a wafer using vision-guided servo control, 2 robots, a high performance stack of stages (X, Y, Theta), 4 vision cameras, and 2 vision boards.

First, an array of parts is robotically loaded into one end of the machine. The vision system then directs the X-Y-Theta table to present an individual part for pickup. The part is then placed onto an air conveyor for transport to the attach station.

After the wafer is aligned, the part is picked up from the end of the conveyor and placed on the wafer to within one micron using another vision-guided X-Y-Theta table. Prior to placement, two dots of adhesive are placed on the wafer using another vision-guided system.

Key Attributes

• Each placement is inspected as it is accomplished and the process data is logged to a file. Each wafer is completely mapped so errors can be flagged for downstream processes. Machine communicates with client system to track bad parts from previous processes as well.
• Can be customized for individual product types. Designed to allow quick change-over between different product types.
• High accuracy, high speed, vision directed part placement and adhesive dispensing.
• Live video feed of alignment and placement. Operators load cassettes of wafers at one end of machine while loading canisters of part arrays at the other. The machine does the rest. During operation, canisters and cassettes can be safely changed without stopping the attach process.