DYMAX 9001-E-v3.1 Chip Encapsulant from DYMAX Corporation

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DYMAX 9001-E-v3.1 Chip Encapsulant

9001-E-v3.1 is a 100% solvent-free, glob top chip encapsulant, which cures in seconds on flexible and rigid printed circuits. This single component material requires no refrigeration and can be cured in shadow areas at 120°C on LOF, COB and multi-chip modules. It has thermal cycle and environmental resistance, good electrical properties.

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