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Ground-Fast ® Heel & Toe Grounding Clip

Product Announcement from Device Technologies, Inc.

Ground-Fast ® Heel & Toe Grounding Clip-Image

Device Technologies' Ground-Fast grounding system quickly attaches a lid or cover to a panel protecting printed circuit boards and electronic components. The fastener combines mounting clips, which quickly snap into holes to create an electrical ground contact from the lid to the panel.

Features and Benefits:

  • Flush surface mounting
  • Fast snap-in or solder attachment
  • Fast removal of lid from panel
  • High closure force
  • High tensile strength


  • 304 Stainless Steel

Electrical Resistivity:

  • 28.4μΩ-in. @ 68°F (72μΩ-cm @ 20°C)

Mounting Dimensions:

  • Clip Hole Diameter: 0.180 in. (4.57 mm)
  • Panel Thickness: 0.060 in. (1.52 mm)