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EFD, Inc. - Colorless No Clean Flux with Anti-slump Features
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These new series leave a totally clear residue for a perfect cosmetic joint finish. In addition, with this flux system, printed or dispensed solder paste deposits retain shape through the reflow cycle without slumping or bridging, making this flux the ideal choice for fine pitch, no-clean electronic and electro-mechanical soldering applications. The use of synthetic resin eliminates the dark amber residue discoloration common with other natural rosin-based fluxes and contributes to the exceptional anti-slump characteristics.
The new P520 flux series is available in PrintPlus printing paste and the D540 series is used in SolderPlus dispensing formulations. Both support EFD's full range of lead-free and tin/lead solder paste alloys. This flux is environmentally safe and exceeds the IPC Joint Industry Standards J-STD-004A.
For further information and application assistance, please call 1-800-338-4353 or email solder@efd-inc.com.
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