EFD Solder Paste Group and Leister Technologies LLC have recently introduced a laser soldering system which consists of EFD's auger valve and TT tabletop dispensing robot, and Leister's Novolas™ laser system.

Laser reflow of solder paste combines the precise, rapid deposition of dispensable solder paste with the high-speed, non-contact, localized heating of modern diode laser systems and is suitable for a wide variety of applications.

EFD's unique SolderPlus® solder paste is specially formulated for fast, clog-free dispensing and is designed to survive the sub-second reflow cycle times common with laser heating.

In addition, lead-free formulations are available that have been specially formulated to withstand the rapid-reflow cycle experienced when soldering with a laser.