Increased Cooling Power for Rack Enclosures and High Heat Density Areas

Liebert X-treme Density heat removal system is designed to address the higher heat loads generated by densely populated electronic rack enclosures. Individual modules can improve enclosure airflow, cool the hot air ejected from the enclosure, or cool hot spots near the enclosures. The modules in the Liebert XD system use a unique heat rejection process, using a waterless XD coolant and Pumping Unit to maintain precise temperature and flow. These modules complement the precision cooling provided by Liebert Deluxe System/3, and are built with the quality and features you expect from Liebert.

XDA Air Flow Enhancer: Lightweight fan unit is mounted to the exhaust side of a rack enclosure. The XDA, that is compatible with most rack enclosures, increases the airflow through densely populated enclosures, past congested cabling, thus removing hot spots within the enclosure that can threaten the uptime of critical systems.

XDO Overhead Fan Coil: This ceiling-installed unit is placed above the heat-emitting equipment, drawing hot air into the coil and discharging air into the Cold Aisle. Uses XD waterless coolant.

XDV Vertical Top Cooler: The XDV is installed on top of a rack enclosure. It can either take the hot air directly from the enclosure and cool the air before it is discharged into the room; or the unit can draw discharged "hot spot" air from the room through the cooling coil and distribute it to the Cold Aisle. Uses XD waterless coolant.

XDP Pumping Unit: The XDP serves as an intermediary, to isolate the building chilled water circuit from the XD coolant circuit. It circulates the coolant to the XDV or XDO and it control the XD coolant fluid temperature to always be above the actual dew point.

The XD Coolant makes the Liebert XD system very energy efficient. The Coolant converts from a liquid to a gas as it absorbs the heat energy in the space. It is later condensed back to a liquid in the XDP and pumped back to the XDO's and XDP's.

Ideal Applications

Colocation facilities Internet data centers Any computing or communications facility with high density of equipment Features

Energy efficient Minimal floor space requirements Waterless XD coolant Scalable Easy to install