Product Announcement from Epoxies Etc...
The weight of 20-3035 Epoxy Syntactic Foam System is less than half of most commercially available potting and encapsulating compounds. This new epoxy foam from Epoxies, Etc... utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product.
This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. The option of selecting from three different curing agents allows end users to customize the physical properties they require.
- Low Density
- Excellent electrical insulation
- Low shrinkage
- Low CTE (coefficient of thermal expansion)
- Excellent water resistance
Samples are available upon request. www.epoxies.com/sample.htm