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20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This two part system is engineered to provide low stress on electronic components and to resist moisture. 20-2353 provides excellent hydrolytic stability, low moisture permeability, a low glass transition temperature, and low stress on sensitive components.
20-2353 maintains its integrity over a wide operating temperature range, -40°C to +125°C. It's low glass transition temperature, -72°C, makes this system ideal for low temperature potting applications.
Benefits:
Typical Specifications:
Color - Black
Specific gravity, @ 25°C
Resin - .9
Catalyst - 1.2
Mix ratio, by weight (R:C) - 100:12
Mix ratio, by volume (R:C) - 100:9
Hardness, Shore A - 50
Pot life, 100 gram mass, 25°C - 2 hours
Viscosity, 25°C, CPS
Resin - 4,000
Catalyst - 175
Mixed - 3,500
Coefficient of thermal expansion, per °C - 2.28 x 10-4Tensile strength, psi - 150
Elongation, % - 60
Glass transition temperature - -72
Dielectric constant, 25°C, 1 KHz - 4.5
Surface resistivity, 25°C, ohm - 1 x 1016
Volume resistivity, ohm-cm - 6 x 1016
Operating temperature range, °C - -40 to +125
Instructions for Use:
1) By weight, thoroughly mix 12 parts 20-2353C Catalyst to 100 parts 20-2353R Resin. By volume, mix 9 parts 20-2353C Catalyst to 100 parts 20-2353R Resin. Two components should be carefully weighed in metal, plastic, or glass containers. Avoid using paper cups and wooden stirrers.
2) Mixed material can be degassed at 1 to 5 mm Hg to ensure bubble free castings. Containers should be large enough to allow frothing.
3) Cure according to one of the following cure schedules:
25°C 24 Hours
65°C 2 Hours
80°C 60 Minutes
Storage and Handling and Safety: Store both components at 75-85F in original containers. If the containers are opened and the contents partially used, the material left in the container should be blanketed with dry nitrogen before sealing. Carefully read Material Safety Data Sheets before using.