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20-3063

POTTING COMPOUND

DESCRIPTION:

20-3063 is an electronic grade potting and encapsulating compound. This is a low cost epoxy system designed for applications requiring a low viscosity. 20-3063 has an easy one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst white for a visual indication that the products have been properly mixed together.

For less filler settling and a slightly higher viscosity use Catalyst 20-3063C HV.

FEATURES:

* Low Viscosity

* Low Cost

* Easy 1:1 Mix Ratio

* Room Temperature Cure

TYPICAL SPECIFICATIONS:

20-3063R Epoxy

20-3063C Curing Agent

Mix Ratio, By Volume or Weight 1:1

Color

Resin Black

Catalyst White

Viscosity, 25°C, cps

Resin 5,500

Catalyst 10,000

Mixed Viscosity, 25°C, cps 6,700

Specific Gravity, 25°C, cps

Resin 1.54

Catalyst 1.53

Pot Life, 100 Gram Mass, 25°C 45 Minutes

Hardness, Shore D 75 - 80

Temperature Range of Use, °C -40 to 130

Dielectric Strength, volts/mil 450

INSTRUCTIONS FOR USE:

1. Some settling of fillers is common during transportation and storage. Remix individual components before using.

2. By weight or volume mix equal parts 20-3063 Resin and Catalyst. Mix thoroughly being careful not to introduce excessive air into the mixture.

3. Pour and allow material to cure according to one of the following schedules:

a) 24 hours at 25 ^oC/77^oF

b) 1 hour at 65 ^oC/150^oF

c) 15 minutes at 100 ^oC/212^oF

IMPORTANT:

The information in this brochure is based on data obtained by our own research and is considered accurate. However, no warranty is expressed or implied regarding the accuracy of this data, the results to be obtained from the use thereof or that any such use will not infringe any patent. This information is furnished upon the condition that the person receiving it shall make his own tests to determine the suitability thereof for his particular purpose.

02/07