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Rotary Position Sensors, Inductive Position Sensor

Rotary Position Sensors, Inductive Position Sensor

Rotary Inductive Position Sensor (P500) from Everight Precision Technologies Corporation. Suitable for angular range between 20° and 160°. An intrinsically safe version, X500, is available.

The P500 RIPS is a high accuracy Rotary Inductive Position Sensor which provides outstanding performance and durability. The sensor uses inductive technology and produces a DC voltage or current output from a DC supply. Each sensor is calibrated to the exact angle required to suit the application.

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The P500 provides a linear output characteristic with rotation with nonlinearity of less than ± 0.25° for 100° rotation. The analogue output signal represents absolute position and is available on power up.

The sensor incorporates a printed circuit coil and custom ASIC electronic interface. It is easy to install and provides outstanding durability, robustness and performance. For demanding applications the P500 is a more durable alternative to RVDT's and potentiometers. A wide range of interface options can be supplied. For applications needing remote sensing a loop powered 4-20mA interface is available.

Performance and stability are excellent over the temperature range –40°C to 85°C. A temperature rating of +125°C is available on some versions. The sensor also offers excellent frequency response to > 10 KHz.

The sensor has a robust stainless steel and anodized aluminum housing sealed to IP65/IP67. The sensor is also available with a range of mounting and cable/connector options including a servo mount housing.

Everight Sensors serves automated equipment and component OEMs and large end users requiring specifically designed LVDT, RVDT, LVIT, RVIT, and SEF based sensor devices to provide linear and angular position information to data acquisition and control systems. Product solutions can integrate all three essential aspects of the application requirement: basic sensor technology and support electronics, mechanical packaging, and system interface. Mechanical packaging considerations include physical interface with actuated components as well as environmental and operating conditions including immersion, pressure, temperature, shock and vibration, and impact. System interface solutions encompass digital interfaces such as Ethernet, Canbus, Devicenet, etc. plus wireless and TEDS "plug and play" technology.

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