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The Telum™ ASLP11 is a single width, full or mid size AMC processor board with an integrated Intel® Core™ 2 Duo processor plus 3100 integrated controller. The assembly is fully compliant to the PICMG AMC.0, R2.0, AMC.1, R2.0 (Type 8 PCI Express), AMC.2 (Type E2 Gigabit Ethernet) and AMC.3 (Serial ATA) specifications.

The Telum™ ASLP11 hosts one Core 2 Duo processor with a 1.5 GHz or higher core clock. The assembly is ready to accept higher performance Core 2 Duo processor variants when introduced by Intel.

Two banks of DDR2-400 SDRAM components are provided on the ASLP11 for a maximum of 4 GBytes of main memory with ECC. These soldered memory banks offer higher levels of mechanical shock and vibration immunity as well as a higher MTBF metric for the overall assembly. The module also hosts a 2 GByte NAND Flash array through an internal USB port and may be provisioned with higher Flash ROM capacities when required for specific applications.

The PCI-Express port on the ASLP11 may be configured as either the root controller or as an end node (target) on a PCI-Express subnet. If the ASLP11 is configured as an end node, a non-transparent bridge function is enabled at the PCI-Express interface to protect the local processor's resources from the remote root controller. The PCI-Express fabric clock FCLKA interface provides a common reference clock in order to support a spread spectrum clock (SSC) signal, and may be configured as either an input or an output on the ASLP11 to support the PCI-Express port configuration.

The Module Management Controller (MMC) on the ASLP11 supports the Intelligent Platform Management Interface (IPMI) v2.0 architecture as defined in the AMC.0 specification and is responsible for power sequencing, hot swap and overall module management. The MMC allows independent platform management between all AMC modules, carrier, power supplies, fans and other accessories in a system. This feature may be used for autonomous monitoring, logging and recovery control functions.

The AMC connector contains the following interfaces:

• Ports 0 & 1: two Gigabit Ethernet ports
• Ports 2 & 3: two S-ATA 1.0 ports
• Ports 4 – 11: monolithic x8 PCI-Express port
• Port 18: USB 2.0 port (optional)
• Port 20: COM port (optional)

Supported operating systems for the ASLP11 include standard distribution Linux and Carrier Grade Linux®.

The module is designed to operate under the NEBS Level 3 environment specifications at the host system. It is also available in an extended operating temperature version (-40° C to +55° C).

The Telum™ ASLP11 is designed for use in a broad range of applications such as wireless base stations, voice over packet, enterprise devices, test and measurement systems, and server blade applications. This, combined with a custom specific assembly service, provides optimized price and performance for a vast number of telecom applications.

Features

• Intel® Core™ 2 Duo L7400 processor, 1.5 GHz core clock, 4 MByte L2 cache
• Single width, full-size or mid-size AMC.0, R2.0 form factor
• AMC.0, R2.0 Hot Swap compliant
• Up to 4 GByte DDR2 SDRAM with ECC in main memory (2 banks of soldered components)
• 2 GByte Flash ROM array (higher capacity array available on request)
• Two Gigabit Ethernet SerDes ports at AMC connector ports 0 & 1 (AMC.2 Type E2)
• Two SATA 1.0 ports at AMC connector ports 2 & 3 (AMC.3)
• PCI Express x8 data port at AMC connector ports 4 – 11 (AMC.1 Type 8)
• PCI Express interface on ALSP11 may be configured as either the root complex or as an end point
• MMC provides IPMI ver.2.0 functionality per AMC.0, R2.0
• Fabric clock (FCLKA) interface supports either clock receive or clock transmit configurations
• USB 2.0 ports available on front panel and at AMC connector port 18
• COM serial port available at either front panel or at AMC connector port 20
• Watchdog & temperature sensor provided
• OS support: standard distribution Linux® and Carrier Grade Linux
• Operates under NEBS Level 3 Environment conditions at the host system
• Optional –40° C to +55° C operating temperature range