Product Announcement from Honeywell Sensing and Control


New Value Added Sensor Assembly Solutions-Image

Integrated Pressure and Thermal Sensor Solutions, Packaging and Termination Options Simplify Design Decisions

Honeywell (NYSE:HON) today announced that it has launched new customizable pressure and thermal sensor solutions – including modules with multiple sensors and technologies integrated inside. Heaters, magnetic, Magneto-resistive, infrared, optical, pressure, thermal, and humidity options are all available for customization. Additional value add options include custom interfaces, I/O, size and shape,  environmental packaging, and total thermal management solutions to make it much easier, faster and more affordable for design engineers to find a Honeywell sensor solution that meets their design parameters.  

With Honeywell’s upfront and ongoing technical support, this customization process enhances the developer design process, ensuring that new and updated designs can be brought to the market quicker. The ability to design in a customized version of an already approved sensor design often means that device developers do not have to re-certify their upgraded products, saving both time and money.

“It is important to provide customers with exactly what they want, all from a single vendor,” said Valerie Rothermel-Nelson, Honeywell senior global product marketing manager. “This is part of Honeywell’s new systematic method of providing integrated and differentiated value added solutions.  Our new approach means that we are now providing higher level assemblies, not just components.  A higher level assembly is a package that provides differentiated and integrated solutions that ultimately give our customers a competitive advantage. It could be combining more than one sensor into higher level packaging, providing custom termination or even providing total thermal management solutions.”

Honeywell’s value-added capabilities build on highly reliable, proven and accurate sensing platforms, while responsive quoting and rapid prototyping processes meet demanding deadlines.

 
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