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As industry demands that electronic packages continue to become smaller and more compact, the need to address the heat generated by these small devices continues to increase. Dissipating this heat and removing it from the unit is a key factor in the performance and longevity of many devices. ITW Insulcast manufactures a number of materials that provide superior heat transfer and thermal conductivity characteristics to meet these demanding requirements.

These materials draw heat out from the unit where it is not wanted and transfer it to the outside where it can be dissipated. Thermally conductive materials that come in a variety of viscosities, mix ratios and hardnesses are available to meet most processing requirements.