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View the presentation of this paper, an overview of the head-in-pillow failure mode and discuss a strategy to minimize this troublesome defect. Head-in-pillow is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA) or Chip-Scale Package (CSP), or even a Package-On-Package (PoP). From cross-sections, it actually looks like a head has pressed into a soft pillow. It has become a relatively common failure mode and hence has generated much concern.

There are two main sources of head-in-pillow defects, poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile, or poor fluxing action to name a few.

The paper will address these sources of defects as arising from three "issues": Supplier Issues, Materials Issues and Process Issues. After thoroughly discussing these issues and how they interplay to result in head-in-pillow defects, a head-in-pillow elimination plan will be presented. Numerous real life examples will be used to illustrate these head-in-pillow solutions.

See the presentation HERE

The presenter Mario Scalzo is a Senior Technical Support Engineer at the INDIUM CORPORATION.

Mario is responsible for providing technical support for advanced SMT process issues, special assignments involving key customer-related projects, product education, and process training of new employees.

Use the links on this page to visit Indium's site and learn more ...