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The drive to produce halogen-free electronics has grown significantly, driven partly by legislation and partly by environmentalist organizations. This paper will discuss the challenges of implementing such a halogen-free assembly process. It will start by briefly discussing the reasons that "halogen-free" is with us. The PCB materials that might contain halogens will then be presented. PWB and component concerns will be briefly reviewed. The bulk of the paper will center on the process development issues in establishing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow and test. Comparisons between halogen containing and halogen-free solder pastes regarding their process performance and reliability will also be presented. The paper will close with a brief review of techniques to analyze halogen content in materials and some of the pitfalls if inappropriate tests are used.

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