CoolMOS™ CE with ISO Standoff package

Product Announcement from Infineon Technologies AG


The new IPAK Short Lead with ISO Standoff package provides mold bumps at the bottom of the package body. These mold features ensure that the package can be fully inserted into the PCB while maintaining a well-defined distance between the PCB and the package body.

After the soldering and cleaning process no residues are left between the PCB and the discrete MOSFET. IPAK Short Lead with ISO Standoff enables more effective cleaning in terms of residue removing, resulting in improved assembly yield and a larger effective creepage distance between the legs.


Features

  • Mold component feature between package body and leads
  • Well-defined standoff height
  • Optimized leg width and length

Benefits

  • More effective cleaning in terms of residue removing, resulting in improved assembly yield
  • Larger effective creepage distance between the legs