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Intermark (USA), Inc. - Thermal Filler Pad

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Our flexible thermal filler pad comes uncured in 2 parts. This provides high thermal conductivity and mechanical cushioning by conforming to uneven surfaces. This can be removed when service is required.

  • Material - Binder Silicone, Filler Alumina
  • Color - Gray
  • Hardness - 50 (Shore 00)
  • Specific gravity - 2.3 g/cm3
  • Continuous usage temp - ‐60C ~ +200C
  • Dielectric constant - 5.5
  • Dielectric breakdown ->10 kV AC
  • Volume resistivity ->1012 ohm‐meter
  • Thermal conductivity 10psi -1.5 /mK
  • Flame Rating UL94 V0

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