ZIF Socket your 0.4mm pitch Shinko BGA package without significant performance loss
BURNSVILLE, MN – September, 2007 – Ironwood Electronics has recently introduced the new high performance BGA ZIF socket for 0.4mm pitch BGA. The SG-BGA-7096 socket is designed for a Shinko 12mm package size; operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 23 milliohms per pin. The socket requires only space on the board for the two mounting screw areas and 2.5mm clearance around the chip so discrete components can be placed near the IC. The SG-BGA-7096 is constructed with high performance and low inductance elastomer. The temperature range is -35 C to +100 C. The pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. The socket accommodates 12mm BGA body size IC packages with 28X28 array and 515 balls. Simply attach the socket to the PCB with two screws, drop in chip, attach lid, and tighten compression screw.
800-404-0204
info@ironwoodelectronics.com
www.ironwoodelectronics.com
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Supplier:
Ironwood Electronics, Inc.
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