Socket your TI 0.4mm pitch TI ZXN (S-PBGA-N209) BGA packages without significant performance loss
BURNSVILLE, MN – July, 2007 – Ironwood Electronics has recently introduced the new high performance BGA socket for 0.4mm pitch BGA. The SG-BGA-7070 socket is designed for a 7mm package size; operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 23 milliohms per pin. The SG-BGA-7070 is constructed with high performance and low inductance elastomer. The temperature range is -35 C to +85 C. The pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. The socket accommodates IC packages such as the TI ZXN (S-PBGA-N209) BGA, 0.4mm pitch FCBGA. Simply attach the socket to the PCB, drop in chip, place easy install swivel lid.
800-404-0204
info@ironwoodelectronics.com
www.ironwoodelectronics.com
|
|
Spring Pin Sockets, BGA SMT Adapters, Package Converters, 0.4mm Pitch BGA Socket, Solder Column Adapters, Clam-Shell BGA Socket, 0.5mm Pitch, 1.0mm Pitch BGA socket, 10 GHz bandwidth, 40 GHz Socket for 0.4mm Pitch QFN Packages, Socket for 0.4mm Pitch QFN Packages, Agilent Compatible Logic Analyzer Adapter, High Performance QFN Socket, BCC sockets, BGA Probing Adapter , QFN Probing Adapter, High Endurance Test Socket, QFP Socket, GHz BGA Socket , High Performance QFN Socket, Spring Pin Socket , SMT Package Emulation , 0.4mm pitch QFN Socket, Logic Analyzer Adapter, QFP Package Emulation, Prototyping Adapter
|
|
|
Supplier:
Ironwood Electronics, Inc.
|
