Lapmaster series KDP Composite Plates for Diamond Lapping and Polishing. Materials available include Iron (primary lapping/roughing), Copper (all-around lap or polish processing), Ceramic (intermediate lap or polish with reduced staining, corrosion and conductivity attributes), Tin-Lead (finish polish) or XP (finish polish). Available in standard diameters of 12" to 36", although custom sizes (smaller and larger) and shapes available. Can be configured in most standard groove patterns including radial, waffle, concentric and spiral grooves. Excellent plate material choice for intermediate or final finishing of Compound Semiconductor materials, when used with a Micro-Groove/Texture pattern.
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