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New High Quality, Low Cost Underfill Encapsulant Developed for Semiconductor Packaging and Assembly Industries.

LORD ME-555 underfill encapsulant is a high purity, semiconductor grade epoxy underfill material for the encapsulation of flip chip devices. Developed to meet technical requirements of customers, LORD has been able to present this material with a significant cost reduction compared to competitive underfill materials.

LORD Corporation has announced a new, low cost underfill encapsulant developed specifically for the semiconductor packaging and assembly industries.

Developed to meet technical requirements of customers, LORD Corporation has been able to present this material with a significant cost reduction compared to competitive underfill materials. Comparable with underfills such as Henkel 4526, the ME-555 offers excellent flow characteristics, thermal cycling reliability and low Coefficient of Thermal Expansion (CTE).

LORD ME-555 underfill encapsulant is a high purity, semiconductor grade epoxy underfill material for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.

Designed with optimum surface tension and viscosity to achieve full coverage without producing bulky fillet or creeping on top of the device, LORD ME-555 will flow consistently without voids while maintaining a fast flow rate. It can be used under CSP/BGAs and small dies with stand-off heights as small as 25 microns. Owing to the low CTE, ME-555 minimizes the possibility of cracking and greatly improves reliability during temperature cycling and temperature shock. Further, LORD ME-555 provides good adhesion to laminate, ceramic, solder mask and metal surfaces, as well as a high Tg and high fracture toughness, which provides a strong mechanical protection for the entire device and prevents premature failures in the package.

According to Jim Greig, sales and marketing manager Electronic Materials, ME-555 was designed to meet industry standards for underfills used in the semiconductor packaging and assembly markets. "Normally the low cost title comes with some sacrifice to the quality - not with ME-555. We listened to our customers' requests and have developed a high quality solution that is still cost-effective," said Greig.

For more information or to request a sample, call 1-877-ASK LORD.