Product Announcement from MEI, LLC
Remove Organic & Metallic Contamination. Fast, Oxide-free drying in a small footprint.
MEI introduces an automated Polysilicon chunk cleaning system for removal of organic and metallic contamination found on polysi. MEI's high throughput wet etch system with good process control and outstanding drying capabilities achieve optimal purity with cool to the touch output. MEI's automated system for chunk polysilicon cleaning removes silicon-chunk surface contaminants and offers exceptional drying capability with vacuum drying in an inert environment. MEI's solution for Poly Silicon chunk etching, cleaning and drying has significant advantages inherent in the carefully thought out design that considers not only operation, but resource use, safety, maintainability, control and flexibility.