Product Announcement from Marktech Optoelectronics
In a world driven by technology, scanning and sensing equipment must constantly evolve to meet new challenges. That's where Marktech can help. Advanced sensing applications require the correct custom solution either in packaged component or assembly form.
Many applications require wavelength in vision applications as objects may require different illumination wavelengths for optimized contrast. An extensive line up of visible, NIR and mid range IR LED die can be packaged in a variety of standard and custom solutions. More popular wavelength combinations include:
660nm - 805nm - 940nm
850nm - 940nm - 1300nm
805nm - 850nm - 940nm
Marktech's engineering and production staff can combine the latest chip technology and packaging options turning customer prototypes within a few weeks. Our additional capabilities of wafer growth, chip slicing and sorting, component packaging and final assembly ensure the highest quality and attention to our customer's needs.
Advanced sensing solutions can also include both the emission and detection functions within a single package or multiple die array. It all starts with our in house technical staff and engineering prototyping lab to put together the details of the application. The following are examples of industries we have served with our designs:
- Military / Aerospace
- Machine Vision
- Industrial Line Equipment
- Linear and Rotary Encoder
Please contact the technical staff at Marktech to discuss your project needs.
Marktech for more than 25 years has been a technology leader specializing in LED chip processing and LED chip packaging. Our technical staff can assist with the design of an optoelectronic solution for customers based upon their application needs. We offer a wide variety of technologies and packaging solutions ranging from LED chips to finished packaging.
Marktech designs and manufactures LED Chip-on-Board assemblies and multichip LEDs which incorporate multiple die configurations or wavelengths ranging from UV to Mid IR. Our technical and production engineers manage a vertically integrated manufacturing process of circuit layout, die wafer and chip processing, die attachment and finished product assembly. Throughout all of our processes, the highest levels of quality assurance are in place making sure that the initial design is carried through the entire process.
Marktech's design capabilities have let to our partnerships with CREE as a Solutions Provider as well as a Digikey as a design Design Partner.
A variety of standard high reliabiity components are available for immediate purchase on the Digikey Website.
About Our State of the Art InP/InGaAs technologies:
Utilizing sophisticated manufacturing processes in Epitaxial InP thin film growth, Marktech is now producing high reliability wafers on 2", 3" and 4" substrates with wavelengths of 1.7µm to 2.6µm. Demands continue to increase for higher transmission rate and longer wavelength components capable of exceeding today's commercially available products with speeds ranging up to 10Gbit/s. It is acknowledged that GaAs and SiGe based components have limitations in terms of speed. Devices based on an InP platform are capable of exceeding these transmission rate limitations, including the operating margin.