Product Announcement from Master Bond, Inc.

Durable Thermal Adhesive Cures at 20°F-Image

Master Bond EP24AN is a fast curing two part epoxy designed to cure at room temperatures and produces high strength bonds to a wide variety of substrates. Master Bond EP24AN possesses an unusual property of curing at temperatures as low as 20°F.It features an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. Other noteworthy features include superior electrical insulation properties, enhanced dimensional stability and tensile shear strength over 1600 psi. EP24AN offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +250°F. A lower viscosity version called EP24ANLV is also available.

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