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Methode has developed an innovative and reliable method to mass terminate wire, cable, flexible circuits or connectors directly to a printed circuit board without any solder, paste, or flux. Known as the Sonicrimp® Process, this mass termination technique is accomplished by aligning the conductors and circuit pads via a plastic cap and cradle and then compressing the exposed conductive surfaces together. Ultrasonic energy is applied to the plastic components surrounding the parts to terminate all of the conductors simultaneously. The conductors are held securely in place on their respective traces with stored energy created during the ultrasonic crimping process.

The Sonicrimp Process eliminates the risks of solder bridging, cold solder joints, the use of environmentally hazardous materials and challenging cleaning requirements. The resulting gas tight termination optimizes the contact surface area for superior conductivity and high reliability over the life of the product. Higher density can be achieved, and the use of multiple wire sizes is also possible in a single termination. With this process, Sonicrimp can terminate printed circuit boards with all types of conductors including; solid or stranded copper wire, plated or tinned wire, thick film conductive inks, flat flexible circuits, headers and other contacts.

Send Methode a drawing and a sample of your printed circuit board and the termination you would like to accomplish using the Sonicrimp process. They will be glad to offer you a Sonicrimp solution to your PCB applications.