Electronic Components Newsletter Signup
Get the IHS Engineering360
Stay up to date on:
Products and processes for electronics design and innovations on solving practical problems with interconnect devices.

Hybrid Assembly

Product Announcement from Mini-Systems, Inc. (MSI)

Hybrid Assembly-Image

MSI provides the electronics industry with the highest quality hybrid microelectronic assembly; offering technical sales and service for all your design needs. Manufacturing capabilities for hybrid assembly, thick film technology, surface mount technology, chip and wire assemblies and electronic packaging. Services include custom layout and design, auto and manual gold wire bonding, specialized substrate metalization, Hermetic sealing, solder reflow, and custom packaging and sub-assemblies.

Services include custom layout and design, auto and manual gold wire bonding, specialized substrate metalization, Hermetic sealing, solder reflow, and custom packaging and sub-assemblies. Compliance to MIL-I-45208A, High-Rel and Quality Standards.