BN300 Substrate for IC
BN300 BGA is a high heat resistant substrate material
developed by using Mitsui's unique polymer-alloy technologies. It furnishes
high temperature performance, such as flexural strength, flexural modulus,
barcol hardness and dimensional stability.
Features include:
• High-heat resistance (Tg = 300ºC).
• Excellent thermal shock resistance
• High reliability
• Low dielectric constant and dissipation factor
• Excellent warpage resistance
• Low Z-axis coefficient of thermal expansion (CTE)
BN300 BGA, an extremely reliable package, is suitable for a
high pin count and thin packages. It is
used in:
• Substrate
for semiconductor packaging
o Substrate
for High temperature chip
o
Bonding
(Au/Au, Au/Sn)
o Ultra
Thin Substrates
·
High performance printed wiring boards (for use
in high temperature environments)
o Automotive
applications
o Burn-in
boards
·
Flip Chip package (high temperature solder
process)
For more information on ball grid array packages, please
visit: http://www.mitsuichemicals.com/bga.htm
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