Delphi's printed circuit board assembly (PCA) manufacturing capability provides customers with high-quality, low-cost assemblies for complex products. Delphi's assembly equipment and operations are designed for quick setup, flexibility, and efficient changeover.
Double-sided, mixed SMT and through-hole technology
Robust product process capable of 12 mil pitch, BGAs, and 0201s
Solder assembly standards defined by IPC-A-610 Class II, with capabilities that extend to Class III
Agilent 3070 ICT platform
Custom board-level functional test design and execution
DFMA evaluation based on Delphi's PCA manufacturing guidelines
Put Delphi's capabilities and global resources to work for you. For more information about contract manufacturing and to speak with a business development manager, please request a quote today!