See Service Details

The plastic used in integrated circuits and other electronic components absorbs a certain amount of moisture. The components may then be subjected to high temperatures during the solder reflow process. The high temperature may cause the moisture to turn to steam, which can "pop" and cause cracking or de-lamination of the component.

Therefore, moisture-sensitive components must be kept dry up to the time of assembly of the PC board. If they are exposed to moisture in a humid atmosphere, they need to be dried out again and packaged to keep them dry. Moisture-sensitive devices need to be protected from high humidity, to prevent damage during PCB assembly.

Nu-Way offers Baking and Dry Packing Service to meet this need.

Baking: The components are packaged in hi-temperature containers (usually trays), placed in an oven and "baked" at 125° C. for 24 hours.

Dry Packing: After baking, the components may be re-packaged into Tape and Reel, or left in their original containers. Nu-Way's dry packing service uses tough, multi-layer bags which offer both MOISTURE BARRIER and STATIC SHIELDING properties. The reel or tray is placed in the bag, along with desiccant and a humidity indicator card. The air in the bag is removed by vacuum, and replaced with nitrogen. The bag is then hermetically sealed to maintain the low-humidity atmosphere and ensure protection until opened at the assembly plant. A product label is then placed on the outside of the bag, along with a "Caution—Moisture-Sensitive Devices" warning label.

Nu-Way also offers clear, not-static-shielding, moisture-barrier bags for more economy when ESD control is not an issue.